105 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP3010 series SP3010 low capacitance esd protection - SP3010 series description applications the SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (esd). this robust device can safely absorb repetitive esd strikes at the maximum level speci?ed in the iec61000-4-2 international standard ( level 4, 8kv contact discharge) without performance degradation. the extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as hdmi, usb3.0, usb2.0, and ieee 1394. features t & 4 %
* & $
8kv contact, 15kv air t & ' 5
* & $
" (5/50ns) t - j h i u o j o h
* & $
3a (t p =8/20s) t - p x d b q b d j u b o d f p g 0.45pf (typ) per i/o t - p x m f b l b h f d v s s f o u p g 0.1a (typ) at 5v t 4 n b m m g p s n g b d u p s v % ' / package saves board space t - $ % 1 % 1 5 7 t t % 7 % 1 m b z f s t t % f t l u p q t t . 1 1 . 1 t 4 f u 5 p q # p y f t t . p c j m f 1 i p o f t t / p u f c p p l t t % j h j u b m $ b n f s b t pinout 5 4 3 2 1 6 7 8 9 10 functional block diagram gnd (pins 3,8) pin 5 pin 2 pin 1 pin 4 gnd (pins 3,8) pin 5 pin 2 pin 1 pin 4 *pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example SP3010 series 0.45pf rail clamp array outside world signal ground hdmi port hdmi chipset d0+ d0- clk+ clk- d2+ d2- d1+ d1- * package is shown as transparent SP3010-04 SP3010-04 ground ground case ground ground ground
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 106 tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP3010 series low capacitance esd protection - SP3010 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 3.0 a t op operating temperature -55 to 125 c t stor storage temperature -60 to 150 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6.0 v reverse leakage current i leak v r =5v, any i/o to gnd 0.1 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10.8 v i pp =2a, t p =8/20s, fwd 12.3 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 1.5 esd withstand voltage 1 v esd iec61000-4-2 (contact) 8 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c i/o-gnd reverse bias=0v 0.45 pf note: 1 parameter is guaranteed by design and/or device characterization. insertion loss (s21) i/o to gnd capacitance vs. bias voltage clamping voltage vs. i pp 0.0 0.1 0.2 0.3 0.4 0. 5 0.6 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 55 .0 i/o bias volt age (v) i/o capacitance (pf) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 1. 5 1.0 2.0 2. 5 3.0 peak pulse current-i pp (a) clamp voltage (v c ) -30 -2 5 -20 -1 5 -10 - 5 0 10 100 1000 10000 frequency (mhz) attenuation (db) pulse waveform 0% 10% 20% 30% 40% 5 0% 60% 70% 80% 90% 100% 110% 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 time (s) percent of i pp
107 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP3010 series SP3010 low capacitance esd protection - SP3010 series time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p reheat ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. part numbering system part marking system sp 3010 0x u t g series package udfn-10 (2. 5 x1.0mm) t= tape & reel g= green number of channels -04 = 4 channel C silicon protection array (spa tm ) family of tvs diode arrays q h 4 product series q = SP3010 assembly site number o f channels part number package marking min. order qty. SP3010-04utg udfn-10 qh4 3000 ordering information
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 108 tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP3010 series low capacitance esd protection - SP3010 series embossed carrier tape & reel speci?cation udfn-10 package dimensions udfn-10 (2.5x1.0x0.5mm) package udfn-10 (2.5x1.0x0.5mm) symbol millimeters a0 1.30 +/- 0.10 b0 2.83 +/- 0.10 d0 ? 1.50 + 0.10 d1 ? 1.00 + 0.25 e 1.75 +/- 0.10 f 3.50 +/- 0.05 k0 0.65 +/- 0.10 p0 4.00 +/- 0.10 p1 4.00 +/- 0.10 p2 2.00 +/- 0.05 t 0.254 +/- 0.02 w 8.00 + 0.30 /- 0.10 k0 a0 b0 p2 p1 p0 t f e w d0 d1 5 o max 5 o max udfn-10 (2.5x1.0x0.5mm) symbol millimeters inches min nom max min nom max a 0.48 0.515 0.55 0.019 0.020 0.021 a1 0.00 -- 0.05 0.000 0.022 a3 0.125 ref 0.005 ref b 0.15 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 d 2.40 2.50 2.60 0.094 0.098 0.102 e 0.90 1.00 1.10 0.035 0.039 0.043 e 0.50 bsc 0.020 bsc l 0.30 0.365 0.43 0.012 0.014 0.016 d e b top view a a bottom view 0.0 5 c b a1 b1 a3 c seating plane side view 0.10 c a m b 0.0 5 c m l e 2xr0.07 5 mm (7x) r0.12 5 0.0 5 c x1 x p p1 z (c) g y (y1) soldering pad layout recomended soldering pad layout dimensions inch millimeter c (0.034) (0.875) g 0.008 0.20 p 0.020 0.50 p1 0.039 1.00 x 0.008 0.20 x1 0.016 0.40 y 0.027 0.675 y1 (0.061) (1.55) z 0.061 1.55 x1 x p p1 z (c) g y (y1) soldering pad layout alternative
|
